About this position
Job Title : IC Packaging Design Engineer
Job Location : Chandler, AZ/ Hillsboro, OR (Onsite)
Duration : 12+ Months
Job Description:
As an IC Packaging Design Engineer, you'll work on physical design and layout of IC packages, driving substrate design and SI/PI-aware implementation for high-performance semiconductor products. You'll collaborate closely with cross-functional teams to ensure designs meet performance, manufacturability, yield, and reliability targets.
What You'll Do
- Perform physical design and layout of IC packages
- Execute substrate design and layout
- Implement SI/PI-aware design practices
- Design for performance, manufacturability, yield, and reliability (DFM/DFY/DFR)
- Ensure design rule compliance across all deliverables
- Use Siemens (Mentor) Xpedition (XPD) or Cadence Allegro/Advanced Package Designer (APD/SiP) for design execution
What You Bring
- Bachelor's or Master's degree in Electrical/Electronics Engineering
- Senior-level: ~10+ years in IC packaging / package design, OR
- Mid-level: 4–6+ years (MS) or 6+ years (BS) in IC packaging / package design
- Strong hands-on experience in Siemens Xpedition (XPD) or Cadence Allegro/APD (SiP)
- Proven experience in substrate design, SI/PI-aware implementation, and design rule compliance
Location and commute
Chandler, AZ 85249.
Plan your route with Google Maps. Travel times and transportation options vary; confirm the work location with the employer before commuting.
How to apply
Review the vacancy and complete the application on the employer or recruitment partner’s website. Requisition ID: WJ-3178023164.